GlobalFoundries — products and connections

  1. Advanced packaging services

    Advanced packaging services: “GlobalFoundries provides advanced packaging services that complement its differentiated technology portfolio and support customers with an end-to-end solution from design to packaging.”

  2. GlobalShuttle™ multi-project wafer program

    GlobalShuttle™ multi-project wafer program: “Our multi-project wafer (MPW) program aggregates multiple projects onto a single wafer, enabling customers to bring their differentiated chip designs to life with the global support of a proven semiconductor leader, while avoiding the cost limitations of test-silicon.”

  3. Increased shuttle frequency

    Increased shuttle frequency: “Shuttle frequency designed to align with customer design cycles without compromising manufacturability.”

  4. Offers & incentives for new and existing customers

    Offers & incentives for new and existing customers: “First-time and existing customers may be eligible for incentives on their initial GlobalShuttle run or when trying a new technology.”

  5. Reduced minimum area requirements and minimum MPW fees

    Reduced minimum area requirements and minimum MPW fees: “Reduced minimum area requirements and MPW fees help customers bring their design vision to life at the scale they need.”

  6. Optimized customer experience

    Optimized customer experience: “Revitalized education package for streamlined onboarding.”

  7. MPW to production incentives

    MPW to production incentives: “New incentives for transitions from MPW to production.”

  8. Increased samples provided

    Increased samples provided: “GlobalShuttle offers the option to double die samples provided, up to 100 die, as part of the base MPW fee, depending on customer and offering.”

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Data formats and record details
Surface ID
urn:readyscan:corpus:relationship:globalfoundries-q691592-products-and-services
Material fingerprint
fnv1a64:af9dee77c9dd9f27
Membership fingerprint
fnv1a64:6a06c8db3a7745df
Published
2026-10-27
Modified
2026-10-27
ready-scan-subjects/Q691592
revision Q691592:content:18a7251ab2d9720e

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