“Contract electronics development in Tokyo. We cover circuit design, PCB design, component procurement, PCB assembly (EMS), and final assembly in house — from prototyping through mass production.”
“We offer one-stop support for the entire process of electronics development, from planning, design, and prototyping to mass production. Specifically, we handle electronics development, camera development, PCB design, simulation, PCB production, electronic component procurement, harness/housing procurement, prototype assembly, and mass production assembly (EMS) — all from our facilities in Tokyo.”
“Yes, you can. We accept requests for individual processes such as design only, prototyping only, mass production only, or component procurement only. We flexibly accommodate your in-house resources and development phase.”
“We have extensive experience in electronics development across a wide range of industries and fields, including industrial equipment, telecommunications equipment, automotive electronics, cameras/optical instruments, measurement instruments, and robotics. We are particularly strong in camera development, having developed our own products such as the Head-Separated Compact Global Shutter Camera and Ultra-Compact Industrial Endoscope.”
“We support all stages from upstream processes such as specification definition, circuit design, PCB design, housing design, and software development, through to prototyping, evaluation, and mass production. We welcome consultations from the idea or concept stage and can assist with organizing technical challenges.”
“We provide standard support for CR8000 Design Force, CR5000 Board Designer, Altium Designer, and OrCAD X Professional. Leveraging your existing design environment and data, we select the optimal design flow for each project.”
“Yes. We accept requests for design only, as well as integrated requests spanning design through prototype and mass production. We flexibly accommodate your development phase and in-house resources.”
“Yes. Our track record includes high-speed circuit design for PCI-Express Gen4, DDR4, USB3.1, HDMI2, MIPI, and more; high multilayer boards up to 32 layers; and advanced PCB specifications such as build-up, IVH, controlled impedance, and rigid-flex boards.”
“Yes. Drawing on over 200 optimization proposals per year, we provide design-stage proposals covering layer count reduction, component placement and routing optimization, and component recommendations — all with a view to cost and mass production suitability.”
“Yes. We work in close collaboration with our assembly department to deliver PCB designs that are optimized for mass production. Integrated requests covering PCB production and prototype or mass production assembly are also welcome.”
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